OMNIE-Tile is a low build-up UFH product manufactured by OMNIE. Using 20mm extruded polystyrene insulation (XPS) faced with cementitious material, the tiles can be laid with confidence on a firm tried and fully tested floor build-up. The OMNIE-Tile panels are routed with 12mm channels with loops at either end of the board to make installation easy to manage with the minimal amount of cutting. The panels are simply fixed or bonded to the subfloor and, in turn, tiles are adhered to the board. As the tiles and adhesive are conductive the heat output and warm-up are sufficient without needing an aluminium diffuser, however, high water temperatures should be avoided as this will lead to noticeable cold spots on the tiled floor where there is no pipe. The product cannot be used with any other floor finish.